Unmatched in Semiconductor Processing and Handling.
3M brings precision, efficiency and performance to your manufacturing process.
Semiconductors
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Improving Semiconductor Processing and Handling
If you are involved in semiconductor production and handling, you should be partnering with 3M. Our expertise in areas like microreplication, nanotechnology and molding provide solutions which help enable the uniformity and precision your processes demand.
For more than 50 years, 3M has been providing a wide range of materials to get you from start to finish in your process. That includes everything from CMP and surface finishing materials for wafer processing to fluids for thermal management to tape and reel for chip transport.
And when you partner with 3M, you have global support. Our technicians are there to help in key locations around the world.
Product Categories
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Adhesives for Temporary Wafer BondingEnabling faster, easier, more reliable ways to build tomorrow's semiconductors. 3M Wafer Support System (WSS) is proven in high‐volume manufacturing for temporary wafer bonding during wafer thinning and additional TSV processes.
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CMP and Surface Finishing Materials3M CMP and surface finishing materials can help increase productivity, improve yields and provide high quality process performance.
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Tape and ReelHelp protect your components during shipping and storage to meet your requirements and increase productivity.
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Test and Burn-In SocketsThe versatile product design helps enable reliable performance for test and burn-in applications
Pad Conditioners
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Pad Conditioners for CMP
3M Pad Conditioners for CMP provide consistent performance for current and advanced technology node chemical mechanical planarization processes. Pad conditioners are available in multiple sizes and configurations to fit most new and legacy CMP tools.
